FIB-SEM Hybrid System XVision 300

State: Out of stock

1. High Quality TEM Lamella Preparation:
Combination of low acceleration voltage FIB and Ar ion beam enables high quality TEM lamella prepatation

2. Real-time Monitoring
Real-time image monitoring at high magnification during Ga ion beam processing is possible with SEM.

3. High Throughput
High throughput cross-sectioning and TEM lamella preparation with high current FIB is possible.

4. Continuous TEM Lamella Auto-finishing Software
"Continuous A-TEM" a continuous TEM lammela finishing software is installed, enabling automatic creation of TEM lamella.

Warranty: 12 tháng

Price: Contact us

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Delivery time: 8h00 - 18h00 daily
Genuine product, provided width CO, CQ
03 months of free warranty for consumable and accessories
12 months of free warranty for main equipment
Accessorie's price is applied only when purchased with
main equipment
Contact us for any particular accessory's quotion

Email: info@redstarvietnam.com Every day in week

Features
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Technical Data:

XVision300	XVision 300 DB/H	XVision 300 DB/F	Xvision 300 TB/H	Xvision 300 TB/F
Sample size	Maximum 300 mm silicon wafer (JEIDA standard wafer)
Sample stage	5-axis motorized eucentric tilting stage
Focused Ion Beam (FIB)
Acceleration Voltage	1 - 30 kV(5 kV step)
Secondary Electron Observation Resolution	4 nm@30 kV
Maximum Current Density	30 A/cm²
Scanning Electron Microscope (SEM)
Acceleration Voltage	1 - 30 kV
Maximum Beam Current	3 nm@5 kV
Argon Ion Beam
Acceleration Voltage	-	-	0.5 - 1 kV	0.5 - 1 kV
Maximum Beam Current	-	-	10 nA(@1 kV)	10 nA(@1 kV)
Sample Handling Options
	FOUP loader	Holder loader	FOUP loader	Holder loader
Option
Micro Probing System 4ch Multi-Gas Supply System