FIB-SEM Hybrid System XVision 200

State: Out of stock

FIB-SEM hybrid system equipped with Hitachi High-Tech Science's latest FIB column and high performance FE-SEM, and FIB-SEM-Ar Triple Beam system equipped with ultra low kV Ar column which can handle the small sample to 200 mm wafer deliver such as high quality TEM sample preparation, Cut&See realtime high resolution obervation and 3D analysis, and EDS analysis.

Warranty: 12 tháng

Price: Contact us

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Delivery time: 8h00 - 18h00 daily
Genuine product, provided width CO, CQ
03 months of free warranty for consumable and accessories
12 months of free warranty for main equipment
Accessorie's price is applied only when purchased with
main equipment
Contact us for any particular accessory's quotion

Email: info@redstarvietnam.com Every day in week

Features
Comments

	1. XVison series is equipped with three detectors
	In-lense SE detector: for low energy SE EsB (Energy selective Backscattered detector): for selectively detects high energy electrons. E-T detector: for obtaining the 3D SE image as it is located offset in the chamber.

	2. Variety of coordinate linkage function (optional)
	Linkage of OM and SIM image Double Cursor function (Japan Patent No.4634134, US Patent No. 7595488) Linkage of Defect inspection and coordinate Linkage with partial wafer as well as full wafer coordinate •Linkage with CAD navigation system

	3. Multi-Gas Injection System (MGS II) (Optional)
	Variety of gasses can be injected such as for passivation, wiring, insulator, and enhanced etching etc.
	Carbon deposition gas Tungsten deposition gas Platinum deposition gas Insulator deposition gas XeF2 etching gas Organic ething gas

	4. Vacuum Transfer function (Optional)
	Sample on the Vacuum Transfer System in the glove box can be transfered to the XVision200 without breaking vacuum. The processed sample in the XVision can be returned to the glove box without breaking vacuum.