Features:

• The ACCμRA M is a manual flip-chip bonder that permits to align manually the components with a high level of precision.
• It allows ± 3 μm accuracy.
• The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process.
• The ACCμRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities.
• It is the perfect equipment for universities and R&D institutes.

Key Benefits

• Small footprint
• Manual machine
• Easy to use
• Open platform
• R&D oriented

Applications

• Flip-Chip, Die attach
• C2C, C2S
• Optoelectronics
• Micro Assembly
• MEMS, MOEMS, MCM