• Hands-free operation, fully automated measurement process under well-defined constant metrology conditions
• Industry-leading polycapillary optics for microspot measurement on structures as small as 10 µm
• Very high detector sensitivity and resolution provide precise results
• Automatic recognition of measurement structures and shift-compensation of measurement spot
• Easy and intuitive system software
• Service and maintenance friendly design
• Designed to work under clean room conditions
• Automated and manual measurements possible with the same instrument

Typical fields of application

• Layer thickness and compositional analysis
• Under-bump metallization (UBM) down to the nm scale
• C4 solder bumps and smaller
• Lead-free solder caps on copper pillars
• Ultra small landing pads and other advanced 2.5D/3D packaging solutions