FilmTek 6000 PAR-SE Robotic
Multi-angle reflectometry and ellipsometry for front-end production measurement of thin films and multi-layers
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FilmTek 6000 PAR-SE Robotic
The FilmTek™ 6000 PAR-SE combines patented Multi-Angle Differential Polarimetry (MADP) and Differential Power Spectral Density (DPSD) technology to independently measure film thickness and index of refraction. By independently measuring index and thickness, the FilmTek 6000 PAR-SE is far more sensitive to changes in films, particularly films within multi-layer stacks, than existing metrology tools that rely on conventional ellipsometry and reflectometry techniques. This is ideal for both ultra-thin and thick multi-layer film stacks used in forming complex device structures.
Measurement Capabilities
Enables simultaneous determination of:
- Multiple layer thicknesses
- Indices of refraction [ n(λ) ]
- Extinction (absorption) coefficients [ k(λ) ]
- Energy band gap [ Eg ]
- Composition (e.g., %Ge in SiGex, % Ga in GaxIn1-xAs, %Al in AlxGa1-xAs, etc.)
- Surface roughness
- Constituent, void fraction
- Crystallinity/Amorphization (e.g., of Poly-Si or GeSbTe films)
- Film gradient
System Components
Standard:
- Spectroscopic ellipsometry with rotating compensator design (295 nm – 1700 nm)
- Multi-angle, polarized spectroscopic reflection (190 nm – 1700 nm)
- Measures film thickness and index of refraction independently
- Multi-Angle Differential Polarimetry (MADP) technology with SCI’s patented Differential Power Spectral Density (DPSD) technology
- Ideal for measuring ultra-thin films (0.03 Å repeatability on native oxide)
- Patented parabolic mirror technology – small spot size measures within a 50×50 µm feature
- Cassette to cassette wafer handling
- Pattern recognition (Cognex)
- FOUP or SMIF compatible
- SECS/GEM
- Advanced material modeling software
- Bruker’s generalized material model with advanced global optimization algorithms
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