FilmTek 2000M TSV Robotic
Spectroscopic reflectometry for measuring film thickness, high-aspect-ratio TSV and trench depth, and critical dimensions
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FilmTek 2000M TSV
The FilmTek™ 2000M TSV is a fully automated metrology tool that utilizes non-destructive optical technology to measure film thickness, through-silicon via (TSV) depth, trench depth, CD, residual silicon, and total thickness variation (TTV) applications in both front-end and advanced packaging development. Based on proprietary data processing and patented hardware that achieves a very small measurement spot size with a nearly collimated beam, the FilmTek 2000M TSV is a highly valuable tool for both semiconductor manufacturing or research and development facilities.
Measurement Capabilities
Enables determination of:
- TSV etch depth for via structures with diameters greater than 1 µm up to a maximum etch depth of 500 µm.
- Height or depth
- Critical dimensions
- Film thickness
System Components
Standard:
- Measure high aspect ratio TSV structures
- Measure TSV etch depth up to 500 µm
- Measure TSV structures with diameter down to 1 µm
- Patented FilmTek technology
- Fast measurement time (~1 second per point)
- TSV etch depth, bump height, critical dimension, and film thickness metrology in a single tool
- Cassette to cassette wafer handling
- Brooks or SCI automation
- 300mm, FOUP, and SMIF compatible
- SECS/GEM
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