FilmTek 4000 Robotic
Fully automated muti-angle reflectometry system for silicon photonics and planar waveguide measurement applications
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FilmTek 4000 Robotic
The FilmTek™ 4000 Robotic metrology system offers fully automated wafer metrology optimized for photonic integrated circuit manufacturing. This system offers several advances designed to enable optical component manufacturers to increase functional yield of their products, reliably and at lower cost.
Utilizing multi-angle reflectometry and patented multi-angle Differential Power Spectral Density analysis capability, the FilmTek 4000 delivers unmatched measurement accuracy required to meet waveguide manufacturing specifications. Measurement resolution is optimized through independent thickness and index (TE and TM modes) measurements of each cladding and core layer, with index measurement resolution up to 2×10-5. This provides a 100x performance advantage over the best non-contact method and 10x that of the best prism coupler contact systems.
System Components
Standard:
- Multi-angle, polarized spectroscopic reflection (400nm-1700nm)
- Measures film thickness and index of refraction independently
- 2×10-5 refractive index resolution
- Automated beam alignment
- Camera for imaging measurement location
- Cassette to cassette wafer handling
- FOUP and SMIF compatible
- Pattern recognition (Cognex)
- SECS/GEM
Optional:
- Spectroscopic ellipsometry with rotating compensator design (400nm-1700nm)
Patented FilmTek 4000 Methodology
FilmTek 4000 systems employ the patented Differential Power Spectral Density (DPSD) technique for high precision refractive index measurement. Spectroscopic reflection data are simultaneously gathered at fixed angles of incidence (0° & 70°) and the same measurement location. PSD processing results in two clear peaks in the Power Spectral Density domain. The ratio of the PSD peak positions is a function of the refractive index of the film and the angle of incidence of the oblique measurement. This ratio allows the refractive index to be calculated independently from thickness. Once the index is known, the thickness can be derived from the optical thickness of the normal incident peak.
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