Red Star Vietnam Co., Ltd. attends Semiconductor Advanced Packaging Forum: Vietnam’s Path Forward at Vietnam National University, Hochiminh City, 14 March 2025

On March 14, 2025, Red Star Vietnam Co., Ltd. participated in Semiconductor Advanced Packaging Forum: Vietnam’s Path Forward, hosted by Vietnam National University, Ho Chi Minh City. The event gathered many scientists, technical experts, representatives from high-tech enterprises, and leading research institutes in the fields of microchips, semiconductors, and electronic testing.

At the forum, Red Star Vietnam Co., Ltd. showcased a range of high-tech equipment solutions dedicated to the semiconductor packaging and testing industry, in collaboration with world-renowned technology brands. Our exhibition booth drew significant attention from R&D centers, research institutes, universities, and businesses across the semiconductor supply chain.

Our participation underscores its strong contribution commitment to the growth of Vietnam’s semiconductor industry. It also serves as a bridge to bring cutting-edge global technologies closer to the local engineering community – opening new opportunities for collaboration, technology transfer, and sustainable development in the future.

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